Honeywell and NXP Semiconductors partner to help enhance building energy management. 

Honeywell (NASDAQ: HON) and NXP® Semiconductors N.V. (NASDAQ: NXPI) have recently inked a Memorandum of Understanding (MOU) at CES 2024, signaling their collaborative efforts to optimize energy consumption control in commercial buildings.

Honeywell (NASDAQ: HON) and NXP® Semiconductors N.V. (NASDAQ: NXPI) have recently inked a Memorandum of Understanding (MOU) at CES 2024, signaling their collaborative efforts to optimize energy consumption control in commercial buildings. Recognizing the significant impact of buildings on global energy consumption and emissions, with 30% and 26% respectively, the collaboration aims to intelligently enhance building operations through the integration of NXP Semiconductors’ industrial-grade applications processors into Honeywell’s building management systems (BMS).

The initial focus of the MOU is on the Honeywell Optimizer Suite, a versatile and future-proofed building control and automation platform. The collaborative efforts seek to deliver smart energy solutions powered by AI/machine learning and data analytics to improve building autonomy, boost energy efficiency, and guide service technicians effectively. The integration of NXP’s neural network-enabled i.MX chipset capabilities is intended to further enhance the product offerings of Honeywell’s BMS.

According to Suresh Venkatarayalu, Honeywell’s Chief Technology Officer, the increasing reliance on data and automation in buildings aims to make them more sustainable and efficient. NXP’s machine learning solutions are expected to contribute to excellence in building automation, aligning with the shared vision to create a smarter and more connected world.

Lars Reger, Chief Technology Officer at NXP Semiconductors, emphasizes the importance of increasing the sustainability and comfort of smart buildings. NXP’s portfolio of securely connected processing solutions, combined with Honeywell’s expertise, is seen as a crucial milestone in their joint vision.

Honeywell plans to leverage NXP’s scalable semiconductor and software solutions, such as the i.MX 8M applications processors and i.MX RT crossover microcontrollers. This collaboration aims to enhance real-time observation, learning, and adaptation in on-site BMS equipment, contributing to improved analytics and decision-making. The integration with cloud-based big data analytics through Honeywell Forge analytics solutions is expected to provide buildings with better foresight and insight, optimizing energy usage for improved sustainability outcomes.

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